Its different but that does not mean it cannot be introduced into your process with existing process equipment. Generally speaking, solders used regally in assembly reflow at over 220 ^oC, low temperature solders reflow at under 180 ^oC or less.

Robotic soldering is growing in popularity and is another area of manufacturing where there is a potential for low temperature. During his presentation Bob Willis will show the practice use of both technologies and the issues still to be resolved